pointí dearadh teirmeach an tsoláthair chumhachta a athrú

    Heat dissipation is an important condition to ensure the safe and reliable operation of switching power adapter. If the temperature is too high, the performance index of the power supply will change, and even the failure of the power adapter will be caused. Therefore, the fundamental task of heat dissipation design is to control the temperature rise so that it does not exceed the specified limit of reliability.

   The components of the switching power adapter have certain requirements for the working temperature range. If the temperature exceeds its limit, it will cause the change of the working state of the power supply, so that the electronic equipment can not work stably and reliably, shorten its service life, and even cause the damage of the electronic equipment.

      Therefore, we should pay more attention to the thermal design of the power supply lasc , seo thíos roinnt pointí dearaidh le haghaidh tagartha agus an réiteach teirmeach á dhearadh do na feistí:

1. Roghnú heatsink. Is é prionsabal an roghnúcháin heatsink ná heatsink a roghnú le méid beag agus meáchan éadrom chomh fada agus is féidir ar an mbonn go n-áiritheofar dóthain diomailt teasa, chun spás inmheánach a shábháil agus meáchan iomlán an oiriúnaitheora cumhachta a laghdú.

2. Installation of heatsink. When installing the heatink, the installation method with small heat dissipation and thermal resistance shall be selected as far as possible.

3. Íoslaghdaigh friotaíocht teirmeach an chomhéadain. Beidh dromchla an heatsink cothrom agus réidh, arna chur i bhfeidhm le ramhar silicone nó gasket seoltaí teasa chun an friotaíocht teirmeach teagmhála idir an radaitheoir agus an leathsheoltóir cumhachta a laghdú.

4. Heatsink surface treatment . In order to increase the radiation capacity of the heatsink, the surface of the heatsink can be coated with a layer of high radiation coefficient coating such as black paint or oxide. The radiator with black coating shall be preferred and the coating shall be protected from damage.

5. Installation position of power semiconductor. The power semiconductor shall be installed in the center of the heatsink, so that the heatsink can be heated evenly and improve the heat dissipation efficiency.

6. Position of heatsink. The heatsink shall be in direct contact with the air flow outside the power supply as far as possible to reduce the ambient temperature. At the same time, the effect of convective heat transfer of radiator can be improved.