Difríocht idir greamaigh solder teocht ard agus greamaigh solder teocht íseal

Go ginearálta, tá greamaigh solder teocht ard comhdhéanta go ginearálta de stáin, airgead, copar agus eilimintí miotail eile, agus tá an pointe leá traidisiúnta os cionn 217 céim. I bpróiseáil sliseanna stiúir, tá iontaofacht an ghreamú solder saor in aisce ar theocht ard-teocht sách ard, agus níl sé éasca le dídhíoltóir agus le scoilteadh.

Is é 138 céim an leáphointe de ghnáth-ghreamú sádrála ar theocht íseal-. Nuair nach féidir le comhpháirteanna an phaiste an teocht 200 céim nó níos airde a sheasamh agus go bhfuil gá leis an bpróiseas athshreabhadh paiste, úsáidfear an greamaigh sádrála íseal-teocht don phróiseas táthú. Ní féidir leis sádráil athshreabhadh ardteochta an bhunaidh agus an PCB a sheasamh. Is é a chomhdhéanamh cóimhiotail ná cóimhiotal biosmat stáin. Is é 170-200 céim an bhuaic-theocht sádrála reflow de ghreamú solder íseal-teocht.

greamaigh solder teocht ard:

1. Tá dea-fheidhmíocht priontála rollta agus titim stáin aige, agus féadann sé freisin priontáil chruinn a chomhlánú le haghaidh pillíní le spásáil chomh híseal le 0.3mm.

2. Several hours after the solder paste is printed, it still maintains its original shape without collapse, and the patch elements will not be offset.

3. It can meet the requirements of different grades of welding equipment, does not need to complete welding in nitrogen filled environment, and can still show good welding performance in a wide range of reflow furnace temperature.

4. The residue of high-temperature solder paste after welding is very little, colorless, has high insulation resistance, will not corrode PCB, and can meet the requirements of no cleaning.

5. It can be used in paste in hole process.

Taosú sádrála teocht íseal:

1. Excellent printability, eliminating omission, depression and fast knot in the printing process.

2. Good wettability, bright, uniform and full solder joints.

3. Suitable for wide process and fast printing.

4. Fully comply with ROHS standards.

       High temperature solder paste is suitable for high temperature welding components and PCB; Low temperature solder paste is suitable for components or PCBs that cannot withstand high temperature welding, such as heatsink module soldering, led soldering, high frequency welding and so on.

     The alloy composition of high temperature solder paste is generally tin, silver and copper (SAC for short); The alloy composition of low-temperature solder paste is generally Sn Bi series, including various alloy components such as SnBi, snbiag and snbicu. Sn42bi58 is a eutectic alloy with a melting point of 138 degree , and other alloy components have no eutectic point and different melting points.