Comhthuiscint ar dhearadh teirmeach

     This section will introduce the thermal design work of semiconductor components in recent years. If there is no mutual understanding between all technical departments related to equipment design, the thermal design of semiconductor components cannot be carried out well. Although the preface is somewhat lengthy before the specific description of thermal design, this is because the thermal design of semiconductor components in recent years is not only related to the technical level of thermal design, but also closely related to the environment and system related to thermal design. Hope to continue working on the premise of understanding this point.  

     Product development generally involves electronic circuit design, mounting circuit board (PCB) design, mechanical design and software design. In the past, these tasks were usually done by specialized designers or responsible departments. For example, electronic circuit designers are responsible for selecting components that meet product specifications and designing circuits; software designers are responsible for developing software for controlling hardware; installing circuit board design The personnel are responsible for designing the circuit board in consideration of appropriate component configuration, layout, and circuit board size; while the mechanical designer is responsible for designing the housing and structure.  

     To achieve the ideal thermal design in this situation, if there is no mechanism that enables each designer to integrate the thermal design into his own design and share it with other designs to make the thermal design a whole design, then It is difficult to create a product with optimized thermal design.  

     For example, we will discuss the design of fanless specifications to adapt to the development trend of equipment miniaturization, low noise and cost reduction. The fan specification should usually be taken by the mechanical designer responsible for the internal cooling of the enclosure, but when there is no fan, which designer can handle the cooling problem? This figure lists what the designer of each part might do as a thermal design.

     You may notice immediately when you see the content. In order to complete the fanless design, the designers of each part need to take corresponding measures to reduce heat generation or improve heat dissipation in their respective parts, and between each measure They are all interrelated. These are often things that cannot be accomplished without mutual communication. If there is no mutual understanding and luck, it is unlikely that the consequences will not occur. Conversely, if you understand each other and communicate smoothly, you may notice problems that you have not noticed only in the part you are responsible for, so you can find more effective solutions.  

     Benefits of optimizing thermal design through mutual understanding.

     There is a word called "design quality". In short, high-quality design is: trial-produced according to the design, no problem, can be put into mass production in a short time, and there is no problem in the market. This is not limited to thermal design, but the result everyone wants. Therefore, it is very important to improve the design quality. In order to achieve high-quality design, in addition to the aforementioned establishment of thermal design and evaluation standards that can meet modern requirements, and mutual understanding, thermal design must be "seriously taken".  

     Although there may actually be problems such as shortage of manpower or cost priority, improving design quality is actually very helpful in solving these problems. As shown in the figure below, if the design quality is improved, the number of trials can be reduced. This in itself can greatly reduce costs, and due to the reduction in rework, not only can it save costs, but also save manpower.