Modhanna éifeachtacha diomailt teasa le haghaidh soilse cosanta ar phléascadh LED

     With the continuous evolution of LED explosion-proof lamp materials and packaging technology, the brightness of LED explosion-proof lamp products has been continuously improved, and the application of LED explosion-proof lamps has become more and more extensive. 

     Using LED explosion-proof lamps as the backlight source of displays has become a hot topic recently. But the heat dissipation problem is the main obstacle in the development of LED explosion-proof lamps as lighting objects.           

     Generally speaking, according to the way of removing heat from the radiator, the radiator can be divided into active heat dissipation and passive heat dissipation. The so-called passive heat dissipation means that the heat of the heat source LED light source is naturally dissipated into the air through the heat sink. The heat dissipation effect is proportional to the size of the heat sink, but because the heat is naturally dissipated, the effect is of course greatly compromised. It is often used in equipment that does not require space, or to dissipate heat for components that do not generate much heat. 

     For example, some popular motherboards also adopt passive heat dissipation on the north bridge. Most of them use active heat dissipation. Active heat dissipation is The heat emitted by the heat sink is forcibly taken away by heat dissipation equipment such as fans, which is characterized by high heat dissipation efficiency and small size of the equipment.

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     Active heat dissipation, subdivided in terms of heat dissipation, can be divided into air cooling, liquid cooling, heat pipe cooling, semiconductor cooling, chemical cooling, and so on.          

     Air-cooling is the most common way of heat dissipation, and in comparison, it is also a cheaper way. Air cooling is essentially the use of a fan to take away the heat absorbed by the radiator. It has the advantages of relatively low price and convenient installation. However, it is highly dependent on the environment, for example, the heat dissipation performance will be greatly affected when the temperature rises and overclocking.

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